PUNCOM's manufacturing infrastructure is one of the best in India and undertakes large scale contract manufacturing activities in the field of Information Technology and Telecommunication.
SMT Pick n Place
- SMT Pick & Place Fuji Aimex IIS
- Chip on board BGA flip chip,ultra fine pitch.
- Fine pitch placement upto 10 mil.
- Max 130 feeder slots (Electronic Intelligent Feeders), Tray Exchanger
- Component coplanarity Check
- CPH CHIP-25000, Fine Pitch - 5000
Electrovert model omniflo 10.
Upper and lower heating.
Forced Air Convection Type.
6 point thermal profiling.
Thermal profile storage:1000.
Solder Paste Screen Printer
- Solder Paste Screen Printer NEO Horizon 03ix.
- Solder paste and glue Screen Printing
- Frame size max upto 29"X29"
- Print speed upto 2mm to 300mm/sec
- System alignment capacity ± 12.5 micron @6Sigma, Upto cpk>/=2
- Cycle Time = 8 Sec + Process
- Single and Double.Wave, No Clean Flux
- Temperature Controlled Pre heaters and Solder bath