PUNCOM's manufacturing infrastructure is one of the best in India and undertakes large scale contract manufacturing activities in the field of Information Technology and Telecommunication.
SMT Pick n Place
- Two lines: SMT Pick & Place Fuji Aimex IIS & Universal model GSM1.
- Chip on board BGA flip chip,ultar fine pitch.
- Fine pitch placement upto 5 mil.
- 130 feeder slots.
- Electrovert model omniflo 10
- Upper and lower heating
- Cooling zone
- Forced Air Convection Type 6 point thermal profiling
- Thermal Profile Storage:1000
Solder Paste Screen Printer
- Solder Paste Screen Printer DEK.256/NEO Horizon 03ix.
- Solder paste and glue dispensing
- Frame size max upto 29"X29"
- Print speed 2mm to 300mm/sec
- System alignment capacity > 2.0 Cmkq+- 20.Um
- Single & double wave, No-flux
- Temperature controlled pre heaters