Punjab Communications Ltd

 A premier Telecom & IT company of India                  ISO 9001:2000 Certified

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PUNCOM's manufacturing infrastructure is one of the best in India lending it the capability of undertaking large scale contract manufacturing activities in the field of Information Technology and Telecommunication. 
SMT Pick n Place Reflow Oven
  • Two lines: Universal Model GSM1 and Siemens Model MS72
  • Chip on board, BGA, flip chip, ultra fine pitch 
  • Glue dispensing
  • Fine Pitch placement up to 10 mil
  • 116 Feeder slots
    Component up to 8 mil, Board Size up to 508mm*457mm
  • 10000 CPH, On-the-fly vision centering 

 

  • Electrovert model omniflo 10
  •  Upper and lower heating 
  • Cooling zone 
  • Forced Air Convection Type 6 point thermal profiling
  • Thermal Profile Storage:1000

Wave Soldering

  • Single & double wave, No-flux
  • Temperature controlled pre heaters

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